Fiber Optic Bonding
EOITech
We offer bonding of fiber optic faceplates and tapers to all types of image sensors from CCD’s to sCMOS imagers, back or front illuminated, large or small. We also offer design services for FO faceplate/taper design as well as assembly services for optics and electro-optic sub-assemblies.
*Manufacturer's specifications subject to change without notice.
EOITech offers a range of optics and electronic assembly services. Our primary market is in the bonding of fused fiber optic faceplates and tapers to image sensors of all types, from CCD’s to sCMOS imagers, back or front illuminated, large or small. The assemblies we create enable a wide range of high performance imaging applications including biomedical, space, low-light, X-ray and electron imaging.
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