Director, Automation & Assembly
AIR-VAC Engineering
Multifunctional assembly systems for micro-assembly for electronics, mechanical assembly, dispensing, bonding/curing, marking, kitting and sorting. Table-top robots to full production cells and lines. IC-900/1200/1800 models with placemnet accuracies down to 3 microns.
*Manufacturer's specifications subject to change without notice.
Manufacturer of automatic and semi-automatic micro-assembly systems for the semiconductor, photonic, automotive and Bio/Pharma markets. Features include wafer ejecting, tray feeders, dispensing, bonding/curing, UV, transport/shuttles, kitting & sorting, rework & repair, magazines and stamping. Placement accuracies down to 3 microns. Machines can be table-top platforms or full production cells.
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