Finetech supplies sub-micron accuracy bonders for photonics packaging and assembly -- laser bars, VCSELs, photo diodes, MEMs, sensors, LEDs, flip chip, copper pillar, etc.  Our systems provide high process flexibility within one platform, accommodating thermo-compression, thermo-sonic, eutectic, epoxy, ACF & Indium bonding. We collaborate with customers to understand their complex applications, and deliver a purpose-built solution.

Technology Partners