Manufacturer of automatic and semi-automatic micro-assembly systems for the semiconductor, photonic, automotive and Bio/Pharma markets. Features include wafer ejecting, tray feeders, dispensing, bonding/curing, UV, transport/shuttles, kitting & sorting, rework & repair, magazines and stamping. Placement accuracies down to 3 microns. Machines can be table-top platforms or full production cells. 

Technology Partners